Heat removal has become an increasingly crucial issue for microelectronic chips due to increasingly high speed and high performance. One solution is to increase the thermal conductivity of the corresponding dielectrics. However, traditional approach to adding solid heat conductive nanoparticles to polymer dielectrics led to a significant weight increase. Here we propose a dielectric polymer filled with heat conductive hollow nanoparticles to mitigate the weight gain. Our mesoscale simulation of heat conduction through this dielectric polymer composite microstructure using the phase-field spectral iterative perturbation method demonstrates the simultaneous achievement of enhanced effective thermal conductivity and the low density. It is shown that additional heat conductivity enhancement can be achieved by wrapping the hollow nanoparticles with graphene layers. The underlying mesoscale mechanism of such a microstructure design and the quantitative effect of interfacial thermal resistance will be discussed. This work is expected to stimulate future efforts to develop light-weight thermal conductive polymer nanocomposites.

This research introduces a novel framework integrating stochastic finite element analysis (FEA) with advanced circular statistical methods to optimize heat pump efficiency under material uncertainties. The proposed methodologies and optimization focus on balancing the mean efficiency and variability by adjusting the concentration parameter of the Von Mises distribution, which models directional variability in thermal conductivity. The study highlights the superiority of the Von Mises distribution in achieving more consistent and efficient thermal performance compared to the uniform distribution. We also conducted a sensitivity analysis of the parameters for further insights. The results show that optimal tuning of the concentration parameter can significantly reduce efficiency variability while maintaining a mean efficiency above the desired threshold. This demonstrates the importance of considering both stochastic effects and directional consistency in thermal systems, providing robust and reliable design strategies.