Heat removal has become an increasingly crucial issue for microelectronic chips due to increasingly high speed and high performance. One solution is to increase the thermal conductivity of the corresponding dielectrics. However, traditional approach to adding solid heat conductive nanoparticles to polymer dielectrics led to a significant weight increase. Here we propose a dielectric polymer filled with heat conductive hollow nanoparticles to mitigate the weight gain. Our mesoscale simulation of heat conduction through this dielectric polymer composite microstructure using the phase-field spectral iterative perturbation method demonstrates the simultaneous achievement of enhanced effective thermal conductivity and the low density. It is shown that additional heat conductivity enhancement can be achieved by wrapping the hollow nanoparticles with graphene layers. The underlying mesoscale mechanism of such a microstructure design and the quantitative effect of interfacial thermal resistance will be discussed. This work is expected to stimulate future efforts to develop light-weight thermal conductive polymer nanocomposites.

In the present study, friction damper, an energy dissipating passive device is explored to reduce the response of open ground storey building under lateral loading due to earthquake. This damper is installed in the selected bays of open ground storey so that the response is reduced. The masonry infill wall is macro-modeled in the form of compression only diagonal members. Three different types of bracing system were installed along with Pall friction damper – single diagonal tension – compression brace with friction damper, tension only cross brace with friction damper and chevron brace with friction damper were modeled using Wen’s plastic link element in SAP2000. G+4 storey buildings were analyzed using nonlinear time history analysis. The storey displacement and inter-storey drift for all the cases were compared in the study.

Magnetic graphene oxide nanocomposites (M-GO) were successfully synthesized by partial reduction co-precipitation method and used for removal of Sr(II) and Cs(I) ions from aqueous solutions. The structures and properties of the M-GO was investigated by X-ray diffraction, Fourier transformed infrared spectroscopy, X-ray photoelectron spectroscopy, transmission electron microscopy, scanning electron microscopy, vibrating sample magnetometer (VSM) and N₂-BET measurements. It is found that M-GO has 2.103 mg/g and 142.070 mg/g adsorption capacities for Sr(II) and Cs(I) ions, respectively. The adsorption isotherm matches well with the Freundlich for Sr(II) and Dubinin–Radushkevich model for Cs(I) and kinetic analysis suggests that the adsorption process is pseudo-second-ordered.

Taking six typical forest communities in Taizhou Green Heart (ⅰ: Liquidambar formosana + Ulmus pumila + Celtis sinensis; ⅱ: Celtis sinensis + Pterocarya stenoptera + Pinus massoniana; ⅲ: Sapindus mukorossi + Sapium sebiferum + Cupressus funebris; ⅳ: Liquidambar formosana + Acer buergerianum + Cupressus funebris); ⅴ: Celtis sinensis + Ligustrum compactum + Pinus massoniana; ⅵ: Machilus ichangensis + Sapindus mukorossi + Acer buergerianum) as the research objects, 5 indicators: Shannon-Wiener (H), Patrick richness (R1), Margalef species richness (R2), Pielou evenness (J) and ecological dominance (D) were used to analyze species diversity in forest communities. The results showed that: (1) the community was rich in plant resources, with a total of 50 species belonging to 40 genus and 31 families, including 19 species in tree layer, 22 species in shrub layer and only 9 species in herb layer, few plant species; (2) the species richness and diversity index of tree layer and shrub layer were significantly higher than that of herb layer, but there were differences among different communities in the same layer, and no significant difference was reached; (3) the species richness and community diversity of the six communities showed as follows: community VI > community I > community II > community IV > community V > community III.